EVG®850 LT

Wafer bonding is a critical enabling technology for SOI wafer fabrication and wafer-level 3D integration. The EVG®850 LT automated production bonding system supports mechanically aligned SOI and direct wafer bonding with LowTemp™ plasma activation. Combining all essential steps for fusion bonding—from cleaning and plasma activation to pre-bonding and IR inspection—the EVG®850 LT streamlines the process in a single system. Field-proven and industry-standard, the EVG®850 LT ensures a high-throughput, high-yield production process, delivering void-free bonds for reliable results.

Features

• SOI and direct wafer bonding with EVG's LowTemp™ plasma activation
• Suitable for a wide range of fusion/molecular wafer bonding applications
• Production system built to operate in high-throughput, high-yield environments
• Automated cassette-to-cassette operation (ergo load, SMIF or FOUP)
• Contamination-free backside handling
• Megasonic and/or brush cleaning
• Pre-bonding with mechanical flat or notch alignment Advanced remote diagnostics