EVG®6200 NT

The EVG®6200 NT delivers high-performance mask alignment with a compact footprint, designed for environments demanding both flexibility and throughput. Available in semi-automated and fully automated configurations—including the fully enclosed Gen2 version—the system is built to meet the rigorous standards of high-volume manufacturing. Featuring integrated vibration isolation, advanced alignment accuracy, and support for EVG’s proprietary SmartNIL™ technology, the EVG®6200 NT excels in a wide range of applications. These include exposure of thin and thick resists, deep cavity patterning, and processing of delicate materials such as compound semiconductors. Designed with ease of use in mind, the system offers quick mask and tooling changes, intuitive software, and a robust global support network—making it a reliable solution for demanding production and research environments alike.

Features

• Wafer/substrate size from pieces up to 200 mm/8’’
• System design supporting versatility of lithography processes
• Throughput up to 180 WPH in first print mode or up to 140 WPH in automatic alignment mode
• Fragile, thin or warped wafer handling of multiple wafer sizes with quick change-over time
• Automated contact-free wedge compensation sequence with proximity spacers Auto origin function for precise centering of alignment key
• Dynamic alignment function featuring real-time offset correction
• Supports the latest UV-LED technology
• Rework sorting wafer management and flexible cassette system
• Manual substrate loading capability on automated system
• Field upgradeable from semi-automated to fully automated version
• Minimized system footprint and facility requirements
• Multi-user concept (unlimited number of user accounts and recipes, assignable access rights, different user interface languages)
• Advanced Software features and compatibility between R&D and full-scale production
• Agile processing and conversion re-tooling
• Remote tech support & SECS/GEM compatibility
• Table top or stand-alone version with anti-vibration granite table
• Additional capabilities:
• Bond alignment
• IR alignment
• Nanoimprint lithography (NIL)