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We're actively recruiting for a range of roles across sales, engineering, IT and warehouse. Check our careers page to see open positions including apprenticeships. 

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Move complex, business-critical equipment

Whether you’re moving a single piece of equipment or an entire production line, our trusted team of engineers can support every step of your move, from rigging to end-to-end relocation support across the globe.

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EVG®6200 BA

The EVG®6200∞ BA bond alignment system delivers high precision, flexibility, and ease of use, making it ideal for a wide range of production environments. With exceptional accuracy, the system supports the most demanding alignment processes in MEMS production, as well as emerging fields like 3D integration applications.

Features

  • Suitable for all EVG 200 mm bond systems
  • Supports bond alignment of double or triple wafer stacks up to 200 mm wafer sizes
  • Manual or motorized alignment stage with automatic alignment option
  • Fully motorized high-resolution bottom-side microscopes
  • Windows® based user interface
  • Options
  • Automatic alignment IR alignment for inner substrate key alignment
  • NanoAlign® package for enhanced process capabilities
  • Available with system rack
  • Upgrade possibility to mask aligner

Speak with one of our experts

Request a callback from one of our team or book a site survey for your project.