EVG®620 NT

The EVG®620 NT is a versatile and reliable mask alignment system designed for both research and high-volume production environments. Its compact footprint and advanced alignment features make it ideal for optical double-side lithography. Available in semi-automated or fully automated configurations, the system meets stringent fab standards and high-volume production requirements. 

Equipped with integrated vibration isolation, the EVG®620 NT delivers exceptional exposure results across a wide range of applications, including exposure of thin and thick resists, patterning of deep cavities and complex topographies, and processing of fragile materials such as compound semiconductors. The system supports both standard lithography processes and EVG’s proprietary SmartNIL™ technology, enabling the patterning of extremely small features down to less than 40 nm.

Operator-friendly software, minimised time for mask and tooling changes, and efficient worldwide service and support make the EVG®620 NT an ideal solution for any manufacturing environment.

Features

• Wafer/substrate size from pieces up to 150 mm/6’’
• System design supporting versatility of lithography processes
• Fragile, thin or warped wafer handling of multiple wafer sizes with quick change-over time
• Automated contact-free wedge compensation sequence with proximity spacers
• Auto origin function for precise centering of alignment key
• Dynamic alignment function featuring real-time offset correction
• Supports the latest UV-LED technology
• Rework sorting wafer management & flexible cassette system
• Manual substrate loading capability on automated system
• Field upgradeable from semi-automated to fully automated version
• Minimized system footprint and facility requirements
• Multi-user concept (unlimited number of user accounts and recipes, assignable access rights, different user interface languages)
• Advanced SW features and compatibility between R&D and full-scale production
• Agile processing and conversion re-tooling
• Remote tech support and SECS/GEM compatibility
• Additional capabilities:
• Bond alignment
• IR alignment
• Nanoimprint lithography (NIL)