EVG®620 BA

EVG®620 BA Use the EVG620 bond alignment system for wafer-to-wafer alignment for wafer sizes up to 150 mm. The tool benefits from the high precision manual alignment stage for which EVG bond alignment systems are recognised, is user-friendly and flexible. Thanks to the precision of this EVG bond alignment system, challenging alignment processes can be accommodated; such as 3D integration applications, and MEMS production.

Features

• Most suitable for EVG®501, EVG®510, and EVG®520 IS bonding systems
• Supports bond alignment of double or triple wafer stacks up to 150 mm wafer sizes
• Manual or motorized alignment stage
• Fully motorized high-resolution bottom-side microscopes
• Windows® based user interface
• Quick tool change between different wafer sizes and different bonding applications
• Options Automatic alignment IR alignment for inner substrate key alignment
• NanoAlign® package for enhanced process capabilities
• Available with system rack
• Upgrade possibility to mask aligner