EVG®610 BA

Renowned for its automation and reliability, the EVG®620 bond alignment system combines high precision, flexibility, and ease of use across various production environments. Its exceptional precision makes it ideal for the most demanding alignment processes in MEMS production and emerging applications, such as 3D integration.

Features

• Most suitable for EVG®501 and EVG®510 bonding systems
• Wafer and substrate sizes up to 150 / 200 mm
• Manual high-precision alignment stage
• Manual-operated bottom-side microscope
• Windows® based user interface
• Perfect multi-user concept (unlimited number of user accounts, various access rights, different user interface languages)
• Desktop system design with minimum footprint
• Supports IR alignment process
• Optimum total cost of ownership (TCO) for R&D and pilot line production