EVG®610

The EVG®610 is a versatile R&D system designed for both mask and bond alignment, accommodating substrates from small pieces up to 200 mm wafers. It supports various lithography processes—including vacuum, hard, soft, and proximity exposure modes—with optional backside alignment. Additionally, the system offers capabilities such as bond alignment, infrared (IR) alignment, and UV Nanoimprint Lithography (NIL). Featuring a high-precision alignment stage and automated wedge compensation, the EVG®610 ensures consistent and accurate results. Its motorised, recipe-controlled exposure gap and support for the latest UV-LED technology enhance process flexibility. The system's compact design minimises facility requirements, and its multi-user interface supports multiple languages and remote diagnostics, making it ideal for academic and research environments.

Features

• Wafer/substrate size from pieces up to 200 mm/8’’
• Top-side and bottom-side alignment capability
• High-precision alignment stage
• Automated wedge compensation sequence
• Motorized and recipe-controlled exposure gap
• Supports the latest UV-LED technology
• Minimized system footprint and facility requirements
• Step-by-step process guidance
• Remote tech support
• Multi-user concept (unlimited number of user accounts and recipes, assignable access rights, different user interface languages)
• Agile processing and conversion re-tooling
• Table top or stand-alone version with anti-vibration granite table
• Additional capabilities:
• Bond alignment
• IR alignment
• Nanoimprint lithography (NIL)