EVG®540

The EVG®540 is an automated single-chamber production bonder, designed for pilot-line manufacturing and R&D in wafer-level packaging, 3D interconnect, and MEMS applications. Built on a modular design, the EVG®540 offers a proven solution for seamlessly transitioning wafer bonding processes from R&D to large-scale manufacturing, integrating smoothly with EVG’s fully integrated production bonding systems.

Features

• Single-chamber bonder up to 300 mm substrate size
• Compatible with SmartView® and MBA300
• Automatic handling of up to four bond chucks
• Compliant to high safety standards