EVG®520 IS

The EVG®520 IS is optimised for small-volume production applications, built on customer feedback and EV Group’s continuous technological innovations. It features EVG’s proprietary symmetric rapid heating and cooling chuck design, delivering superior temperature and force uniformity for precise bonding. With high-force bonding capability and the same material and process flexibility as manual systems, the EVG®520 IS ensures the success of all wafer bonding processes, making it a reliable solution for diverse production needs.

Features

• Fully automated processing with manual loading and unloading including external cooling station
• Compatible with EVG mechanical and optical aligners
• Single- or double-chamber automated system
• Fully automated bond process execution and bond cover movements
• Integrated cooling station for high throughput
• Options: High vacuum capability (1E-6 mbar) Programmable mass flow controller
• Integrated cooling