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Move complex, business-critical equipment

Whether you’re moving a single piece of equipment or an entire production line, our trusted team of engineers can support every step of your move, from rigging to end-to-end relocation support across the globe.

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EVG®510

The EVG®510 is a highly flexible wafer bonding system, supporting a wide range of processes including anodic, glass frit, solder, eutectic, transient liquid phase, and direct bonding. Its easy-access bond chamber and intuitive tooling design facilitate quick retooling for different wafer sizes and processes, making it an excellent choice for universities, R&D facilities, and low-volume production applications. The bond chamber design closely mirrors that of EVG’s high-volume manufacturing tools, such as the EVG® GEMINI, ensuring compatibility and enabling easy transfer of bonding recipes. This makes the EVG®510 an ideal platform for scaling up production volumes as needs evolve.

Features

  • Unique pressure and temperature uniformity
  • Compatible with EVG mechanical and optical aligners
  • Flexible design and configurations for research and piloting
  • Form single chips to wafers
  • Various processes (eutectic, solder, TLP, direct bonding)
  • Optional turbopump (<1E-5 mbar)
  • Upgradeable for anodic bonding
  • Open chamber design for easy conversion and maintenance
  • Production compatible
  • High throughput with fast heating and pumping specifications
  • High yield through automatic wedge compensation
  • Open chamber design for fast conversion and maintenance
  • Smallest footprint for a 200 mm bonding system: 0.8 m2
  • Recipes are fully compatible with EVG’s high-volume-manufacturing bonding systems

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