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Move complex, business-critical equipment

Whether you’re moving a single piece of equipment or an entire production line, our trusted team of engineers can support every step of your move, from rigging to end-to-end relocation support across the globe.

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EVG®501

The EVG®501 is a highly flexible wafer bonding system, supporting all common bonding processes, including anodic, glass frit, solder, eutectic, transient liquid phase, and direct bonding. Its easy-access bond chamber and user-friendly tooling design enable quick retooling for different wafer sizes and processes, making it ideal for universities, R&D facilities, and low-volume production. The bond chamber design mirrors that of EVG’s high-volume manufacturing tools, such as the EVG® GEMINI, ensuring seamless scalability. Bonding recipes are easily transferable, enabling smooth transition to larger production volumes as needs grow.

Features

  • Unique pressure and temperature uniformity
  • Compatible with EVG mechanical and optical aligners
  • Flexible design and configurations for research
  • From single chips to wafers
  • Various processes (eutectic, solder, TLP, direct bonding)
  • Optional turbopump (<1E-5mbar)
  • Upgradeable for anodic bonding
  • Open chamber design for easy conversion and maintenance
  • Pilot production compatible
  • Open chamber design for easy conversion and maintenance
  • Smallest footprint for a 200 mm bonding system: 0.8 m2
  • Recipes are fully compatible with EVG’s high-volume-manufacturing bonding systems

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Request a callback from one of our team or book a site survey for your project.