EVG®50

The EVG®50 (fully automated stand-alone tool) and the Inline Metrology Module (integrated into EVG’s high-volume manufacturing systems) provide highly accurate, high-speed measurements using a variety of measurement methods for a wide range of applications. The system is designed for multi-layer thickness measurements, including determination of the total thickness variation (TTV) of intermediate layers, bond interface inspection, and resist thickness measurement. Engineered to meet the stringent demands of the yield-driven semiconductor industry, the EVG®50 and Inline Metrology Module ensure precision and efficiency in production environments.

Features

• Multi-layer metrology with industry-leading throughput and resolution
• Multi-layer-thickness mapping
• Bond interface inspection
• Low contact edge handling
• Particle free
• Full-area accessible front- and backside
• Self-calibrating for better system reproducibility and more productive time
• Various output formats 100% production inspection