EVG®320

The EVG®320 is an automated single wafer cleaning system that handles wafers and substrates automatically between process stations. Equipped with a robotic handling system, it ensures precise pre-alignment and loading of wafers, supporting both cassette-to-cassette and FOUP-to-FOUP operations.

Features

• Up to four cleaning stations
• Fully automated cassette-to-cassette or FOUP-to-FOUP handling
• Edge handling for double-sided cleaning processes available (option)
• High-efficiency cleaning using 1 MHz megasonic nozzles or area transducers (option)
• Advanced remote diagnostics
• Prevents cross-contamination from back to front side
• Fully software controlled cleaning process