EVG®301

The EVG®301 is a versatile semi-automated single wafer cleaning system, featuring a single cleaning bowl and manual loading with pre-alignment. Designed for flexible cleaning procedures, the EVG®301 is an ideal R&D tool for various cleaning needs. It can be seamlessly integrated with EVG’s wafer alignment and bonding systems to remove particles prior to wafer bonding, or combined with EVG’s debonding systems to eliminate temporary bonding adhesive after debonding.

Features

• High-efficiency cleaning using 1 MHz megasonic nozzles or area transducers (option)
• Brush scrubbing for single-side cleaning (option)
• Diluted chemicals for wafer cleaning
• Prevents cross-contamination from back to front side Fully software controlled cleaning process
• Options:
  
  
  1. Pre-bonding station with IR-inspection
  2. Tooling for non-SEMI standard substrates