EVG®20

The EVG®20 provides a rapid and efficient inspection method, particularly for fusion-bonded wafers. Using live IR transmission, it captures an image of the entire wafer, enabling void detection with a precision down to a radius of 500 µm—making it an ideal solution for fusion bonding processes. Additionally, the system supports bond strength measurements using the Maszara method, ensuring comprehensive analysis of bond quality.

Features

• Live imaging
• One-shot inspection of the entire wafer
• Optional bond pin for live visualization of direct bonding
• Maszara test compatible
• Void size detection down to 0.5 mm radius