EVG®105

The EVG®105 bake module is designed for post-exposure bake, softbake, and hardbake processes, ensuring uniform evaporation within a precisely controlled environment. Programmable proximity pins provide optimal control over temperature profiles and resist hardening, delivering superior process consistency. The EVG®105 can process up to four 100 mm wafers or a single 300 mm wafer concurrently, making it a versatile solution for high-efficiency processing in a variety of applications.

Features

• Stand-alone bake module Up to 300 mm wafer size or up to four 100 mm wafers at the same time
• Temperature uniformity ≤ ± 1 °C @ 100 °C, up to 250 °C bake temperature
• Loading pins for manual and safe wafer loading/unloading
• Timer for bake
• Substrate vacuum (direct contact bake)
• N2 purge and proximity bake 0-1 mm distance wafer to heat plate optional
• Irregular shaped substrates