EVG®101

The EVG®101 is a versatile resist processing system designed for R&D applications, fully compatible with EVG’s automated systems. Supporting wafers up to 300 mm, the EVG®101 offers configurations for both spray and spin coating, as well as developing. Equipped with EVG’s advanced OmniSpray™ coating technology, the system achieves conformal layers of polymers or photoresists on 3D structured wafers. This technology minimizes material consumption of high-viscosity photoresists and polymers, while improving resist spreading and uniformity for enhanced process control.

Features

• Wafer size up to 300 mm
• Automated spin or spray coating or developing with manual wafer load/unload Quick and easy process transfer from research to production utilizing proven modular design and standardized software
• Syringe dispense system for utilization of small resist volumes, including high-viscosity resists
• Small footprint while maintaining a high level of personal and process safety
• Multi-user concept (unlimited number of user accounts and recipes, assignable access rights, different user interface languages)
• Options:
• Uniform coating of high-topography wafer surfaces with OmniSpray® coating technology
• Wax and epoxy coating for subsequent bonding processes
• Spin-On-Glass (SOG) coating