EVG®850 TB

The fully automated temporary bonding system streamlines the entire temporary bonding process, from adhesive application and baking to alignment and bonding of the device wafer to the carrier wafer, all within a single automated tool. Featuring a modular layout, consistent with all EVG’s fully automated tools, the system can be throughput-optimized based on specific process needs. Thanks to EVG’s open platform design, the system supports a variety of temporary bonding adhesives, including spin-coat thermoplastics, thermoset materials, and tapes, offering flexibility for diverse applications.