EVG®850 TB

The fully automated temporary bonding system streamlines the entire temporary bonding process, from adhesive application and baking to alignment and bonding of the device wafer to the carrier wafer, all within a single automated tool. Featuring a modular layout, consistent with all EVG’s fully automated tools, the system can be throughput-optimized based on specific process needs. Thanks to EVG’s open platform design, the system supports a variety of temporary bonding adhesives, including spin-coat thermoplastics, thermoset materials, and tapes, offering flexibility for diverse applications.

Features:

• Open adhesive platform
• Various carriers (silicon, glass, sapphire, etc…)
• Bridge tool capability for different substrate sizes
• Available with multiple load port options and combinations
• Recipe controlled system
• Real time monitoring and recording of all relevant process parameters
• Fully integrated SECS/GEM interface
• Optional integrated inline metrology module for automated feedback loop