EVG®850 DB

The EVG®850 DB is a fully automated debonder designed for the separation and cleaning of processed temporary bonding wafer stacks. To ensure the fragile device wafers remain securely supported throughout the process, they are mounted either via film frame or handled using a thin wafer handler.

Features

• Reliable handling of thinned, bowed and warped wafers with and without topography
• Automated cleaning of debonded wafer
• Recipe controlled system
• Real time monitoring and recording of all relevant process parameters
• Fully integrated SECS/GEM interface in automated tools
• Bridge tool capability for different substrate sizes
• Modular tool layout → throughput-optimized depending on specific process