EVG®805

The EVG®805 is a specialised system for debonding temporarily bonded wafer stacks, which typically consist of a device wafer, a carrier wafer, and an intermediate temporary bonding adhesive.The system supports both thermal and mechanical debonding processes, providing flexibility based on specific needs. Once debonded, the thin wafer is safely unloaded onto a single substrate carrier, ensuring reliable transport between tools and minimising handling risks.

Features

• Open adhesive platform
• Debond Options:
• Thermal slide off debonding
• Lift off debonding
• Mechanical debonding
• Recipe controlled system
• Real time monitoring and recording of all relevant process parameters
• Unique features for thin-wafer handling
• Various chuck designs to support wafer/substrates and carriers up to 300 mm
• High topography wafer handling