EVG®510

The EVG®510 is a highly flexible wafer bonding system, supporting a wide range of processes including anodic, glass frit, solder, eutectic, transient liquid phase, and direct bonding. Its easy-access bond chamber and intuitive tooling design facilitate quick retooling for different wafer sizes and processes, making it an excellent choice for universities, R&D facilities, and low-volume production applications. The bond chamber design closely mirrors that of EVG’s high-volume manufacturing tools, such as the EVG® GEMINI, ensuring compatibility and enabling easy transfer of bonding recipes. This makes the EVG®510 an ideal platform for scaling up production volumes as needs evolve.

Features

• Unique pressure and temperature uniformity
• Compatible with EVG mechanical and optical aligners
• Flexible design and configurations for research and piloting
• Form single chips to wafers
• Various processes (eutectic, solder, TLP, direct bonding)
• Optional turbopump (<1E-5 mbar)
• Upgradeable for anodic bonding
• Open chamber design for easy conversion and maintenance
• Production compatible
• High throughput with fast heating and pumping specifications
• High yield through automatic wedge compensation
• Open chamber design for fast conversion and maintenance
• Smallest footprint for a 200 mm bonding system: 0.8 m2
• Recipes are fully compatible with EVG’s high-volume-manufacturing bonding systems