EVG®501

The EVG®501 is a highly flexible wafer bonding system, supporting all common bonding processes, including anodic, glass frit, solder, eutectic, transient liquid phase, and direct bonding. Its easy-access bond chamber and user-friendly tooling design enable quick retooling for different wafer sizes and processes, making it ideal for universities, R&D facilities, and low-volume production. The bond chamber design mirrors that of EVG’s high-volume manufacturing tools, such as the EVG® GEMINI, ensuring seamless scalability. Bonding recipes are easily transferable, enabling smooth transition to larger production volumes as needs grow.

Features

• Unique pressure and temperature uniformity
• Compatible with EVG mechanical and optical aligners
• Flexible design and configurations for research
• From single chips to wafers
• Various processes (eutectic, solder, TLP, direct bonding)
• Optional turbopump (<1E-5mbar)
• Upgradeable for anodic bonding
• Open chamber design for easy conversion and maintenance
• Pilot production compatible
• Open chamber design for easy conversion and maintenance
• Smallest footprint for a 200 mm bonding system: 0.8 m2
• Recipes are fully compatible with EVG’s high-volume-manufacturing bonding systems