EVG®40 NT

The EVG®40 NT (stand-alone tool) and AVM (HVM-integrated module) are designed to measure key lithography parameters, such as critical dimensions and bond alignment accuracy. With its high measurement precision, the system ensures compliance with stringent process specifications and enables real-time optimisation of integrated process parameters. Thanks to its versatile measurement capabilities, the EVG®40 NT adapts to a wide range of manufacturing processes, including nanoimprint lithography and wafer-to-wafer bonding. For example, the EVG®40 NT serves as the essential tool for verifying the 100 nm bond overlay accuracy of EVG's GEMINI FB automated fusion bonding system, completing the product range for highly accurate aligned wafer bonding.

Features

• Versatile measurement options for lithography and bonding metrology
• Alignment verification for bonding and lithography applications
• Top- to bottom-side microscope for manifold measurement methods
• Critical dimension (CD) measurement
• Die-to-die alignment verification
• Multi-layer thickness measurement
• High measurement accuracy in vertical and lateral direction
• High throughput due to specialized calibration routine
• PC-based measurement and pattern recognition software for highest reliability