- Equipment Partners
- EV Group
- Metrology
- EVG®20
EVG®20
The EVG®20 provides a rapid and efficient inspection method, particularly for fusion-bonded wafers. Using live IR transmission, it captures an image of the entire wafer, enabling void detection with a precision down to a radius of 500 µm—making it an ideal solution for fusion bonding processes. Additionally, the system supports bond strength measurements using the Maszara method, ensuring comprehensive analysis of bond quality.
Features
- Live imaging
- One-shot inspection of the entire wafer
- Optional bond pin for live visualization of direct bonding
- Maszara test compatible
- Void size detection down to 0.5 mm radius
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