BONDSCALE

The EVG® BONDSCALE is designed to support a wide range of fusion and molecular wafer bonding applications, including engineered substrate manufacturing and 3D integration approaches such as monolithic 3D (M3D) layer-transfer processing. By bringing wafer bonding to front-end semiconductor processing, BONDSCALE addresses long-term challenges for "More Moore" logic device scaling, as outlined in the International Roadmap for Devices and Systems (IRDS). Incorporating advanced edge alignment technology, BONDSCALE boosts wafer bond productivity and reduces the cost of ownership (CoO) compared to existing fusion bonding platforms. Sold alongside EVG’s industry-leading GEMINI FB XT automated fusion bonding system, BONDSCALE targets engineered substrate bonding and layer-transfer processing, while the GEMINI FB XT is optimized for applications that demand higher alignment accuracy, such as memory stacking, 3D systems on chip (SoC), backside illuminated CMOS image sensor stacking, and die partitioning.

Features

• Fully automated fusion/molecular wafer bonding applications on 200 mm and 300 mm substrates in a single platform
• Direct wafer bonding with plasma activation for heterogeneous integration of different materials, high-quality engineered substrates as well as thin-silicon layer-transfer applications
• Layer-transfer processes and engineered substrates enabling logic scaling, 3D integration such as M3, 3D VLSI including backside power distribution, N&P stacking, logic-on-memory, clustered functional stacks and beyond-CMOS adoption