scia Clean 1500

Used to clean larger three-dimensional shaped substrates via vacuum description, thermal desorption and plasma treatment; the scia Clean 1500 is designed for applications such as the ultra-high purity cleaning of medical objects or optical components.

Separate cleaning systems for the substrate and chamber are available with the scia Clean 1500, ensuring an optimum base pressure, using mass spectroscopy measurement for quantifying small residual contaminations on the substrate. Plasma source quantities can be selected according to customer requirements, improving the cleaning process. The transfer system is used for substrates up to a weight of three tonnes.

Key Features:

• Low base pressure and fast pumping due to electropolished and heated vacuum chamber
• Separate substrate heating for improved desorption
• Qualification of residual contamination by high-sensitive mass spectroscopy
• Selectable quantity of plasma sources for advanced cleaning with H₂ plasma
• Recipes for repeatable temperature ramps and fully automated cleaning cycles
• Transfer system for loading of heavy substrates

Technical Data:

• Substrate size (up to) - 1500 mm dia., 1700 mm length, 2 t 
• Substrate heating - Radiation heaters (20 kW) up to 250 °C
• Chamber heating and cooling - Pressurized water based heating up to 150 °C 
  and cooling (48 kW)
• Plasma sources - Up to 10 optional ICP plasma sources (PI400), 
  max. 2.5 kW per source
• Base pressure - < 5 x 10-9 mbar
• Quality control - Mass spectrometer for quantitative outgassing measurement
• System dimension (W x D x H): 8.00 m x 4.20 m x 3.60 m
  (without electrical rack and pumps)
• Configurations - Single chamber with front door, loading via transfer system with transport carriers.
• Software interfaces - SECS II / GEM, OPC

Applications:

• High‑purity vacuum systems / accelerator & research facilities: Particle accelerators, synchrotrons, beam‐line components require extremely clean large assemblies with low outgassing.
• Optics & photonics (large optics): Large diameter optics (mirrors, lenses) used in ultra‑high vacuum, X‑ray optics, large telescopes — need cleaning of 3D shapes and heavy components.
• Semiconductor equipment / deposition chambers: Large vacuum chambers, process modules, vacuum enclosures in advanced fabs might need such cleaning capabilities.
• Aerospace / satellite components: Large structural parts, vacuum‐compatible components where contamination must be minimized (e.g., for space instrumentation).
• Large industrial modules that go into vacuum or high purity environments: e.g., vacuum furnaces, vacuum heat‐treatment chambers, UHV manufacturing equipment.
• Specialized manufacturing of large parts / assemblies with tight cleanliness and outgassing specs.