EVG®20

The EVG®20 provides a rapid and efficient inspection method, particularly for fusion-bonded wafers. Using live IR transmission, it captures an image of the entire wafer, enabling void detection with a precision down to a radius of 500 µm—making it an ideal solution for fusion bonding processes. Additionally, the system supports bond strength measurements using the Maszara method, ensuring comprehensive analysis of bond quality.

Features:

• Live imaging
• One-shot inspection of the entire wafer
• Optional bond pin for live visualization of direct bonding
• Maszara test compatible
• Void size detection down to 0.5 mm radius

Applications:

• Fusion Bonding Quality Control
  The EVG®20 is particularly effective for inspecting fusion-bonded wafers, providing detailed insights into bond quality and uniformity.
  
  
• Void Detection
  It identifies voids as small as 500 µm in radius, which is critical for ensuring the structural integrity of bonded layers.
  
  
• Bond Strength Measurement
  The system supports fully automated bond strength measurements using the Maszara test, allowing for precise evaluation of bond robustness.
  
  
• Live Bond Wave Visualization
  With an optional bond pin, the EVG®20 enables real-time visualization of bond wave propagation, aiding in the assessment of bond uniformity and quality.