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A Complex Intercontinental Move and Assembly Project for Multiple Ion Implanters

At IES, we love a challenge. In fact, the more complex the project is, the better.

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Ion Implanter in a Fab

The Subtle Art of Relocating Complex, One-of-a-Kind Equipment Across Borders

Few complex engineering projects compare to the challenge of relocating sensitive, high-technology equipment across borders.

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Trusted Partners for the Microelectronics Industry

At IES, we partner with leading global manufacturers to provide an extensive portfolio of advanced technologies supporting research, development, and production across the semiconductor and compound materials industries.

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Move complex, business-critical equipment

Whether you’re moving a single piece of equipment or an entire production line, our trusted team of engineers can support every step of your move, from rigging to end-to-end relocation support across the globe.

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EVG®520 HE

The EVG520 HE is designed for high-precision thermoplastic substrate imprinting. This semi-automated hot embossing system can be used with substrates up to 200 mm in diameter. It is compatible with industry standard semiconductor manufacturing technologies and is configured with high-vacuum and high-contact force functions, as well as a universal embossing chamber. The EVG520 HE manages the complete selection of polymers which are suited to hot embossing. The system provides a range of processes for high-quality nanopattern transfer, along with multiple de-embossing and high-aspect-ratio embossing options.

Features:

  • For hot embossing and nanoimprinting applications of polymer substrates and spin-on polymers
  • Automated embossing process
  • EVG's proprietary separate alignment process for optically aligned embossing and imprinting
  • Pneumatic de-embossing options
  • Software-controlled process execution

Book a Live or Virtual Demo

See the capabilities of our partners' equipment - including EVG, scia Systems, Veeco, PPS and SSI - in action. Experience tailored demonstrations designed around your process and application needs.