EVG®105

What is the EVG®105 bake module?

The EVG®105 is a bake module designed for post-exposure bake, softbake, and hardbake processes within resist processing workflows. It performs these steps in a precisely controlled environment that ensures uniform evaporation, delivering consistent, repeatable results across production and R&D applications.

IES is the official UK representative for EV Group (EVG), supplying, installing, and supporting the EVG®105 for customers across the UK.

How does it control temperature and resist hardening?

Programmable proximity pins give precise control over temperature profiles and resist hardening, so operators can tailor bake conditions to specific process requirements rather than relying on fixed settings — improving consistency across batches and resist types.

What wafer capacity does it offer?

The EVG®105 can process up to four 100 mm wafers, or a single 300 mm wafer, concurrently — making it a versatile solution for high-efficiency processing across a range of wafer sizes and applications.

Where can I buy or get support for the EVG®105 in the UK?

As EV Group's official UK representative, IES provides UK-based sales, installation, and engineering support for the EVG®105 and the wider EVG resist processing and lithography portfolio.

Features:

• Stand-alone bake module Up to 300 mm wafer size or up to four 100 mm wafers at the same time
• Temperature uniformity ≤ ± 1 °C @ 100 °C, up to 250 °C bake temperature
• Loading pins for manual and safe wafer loading/unloading
• Timer for bake
• Substrate vacuum (direct contact bake)
• N2 purge and proximity bake 0-1 mm distance wafer to heat plate optional
• Irregular shaped substrates

Applications: 

• Soft Bake
  After resist spin or coating, to drive off solvent and stabilize resist before exposure.
  
  
• Post‑Exposure Bake (PEB)
  After exposure, when resist chemistry requires thermal activation (e.g. in chemically amplified resists) or diffusion of species for contrast enhancement.
  
  
• Hard Bake
  After development, to harden/anneal the resist, reduce edge roughness, improve adhesion or stability.
  
  
• Process Development & R&D
  In research labs or development fabs, having a dedicated bake module allows tuning of bake temperatures, proximity gaps, gas environment (e.g. N₂ purge) to optimize resist performance, crosslinking, stress, film properties, etc.
  
  
• Support for Irregular / Non‑Standard Substrates
  Since the EVG 105 supports irregular shaped substrates (not just circular wafers), it is useful where the substrate is nonstandard (cut pieces, dies, custom shapes) and still requires precise baking.
  
  
• Integration into Larger Lithography / Resist Systems
  As a module, it can be integrated into a larger resist processing line or cluster, so that coating → bake → exposure → develop processes are executed in a controlled, modular fashion.
  
  
• Minimizing Contamination / Atmospheric Control
  The N₂ purge option allows control over ambient gas (e.g. reducing moisture, oxygen) during baking, which can improve resist stability, reduce defects, and improve reproducibility.
  
  
• High Uniformity / Precision Applications
  In applications where resist thickness uniformity, controlled crosslinking, edge effects, and thermal gradients matter (e.g. advanced lithography, nanoimprint pre-bake, MEMS), the ±1 °C uniformity and proximity control are beneficial.