EVG®850 TB

What is the EVG®850 TB?

The EVG®850 TB is a fully automated temporary bonding system that streamlines the entire temporary bonding process — from adhesive application and baking to alignment and bonding of the device wafer to the carrier wafer — all within a single automated tool.

IES is the official UK representative for EV Group (EVG), supplying, installing, and supporting the EVG®850 TB for customers across the UK.

How is the EVG®850 TB's layout designed?

Featuring a modular layout, consistent with all EVG's fully automated tools, the system can be throughput-optimised based on specific process needs — from lower-volume R&D use through to high-throughput production.

What temporary bonding adhesives does the EVG®850 TB support?

Thanks to EVG's open platform design, the system supports a variety of temporary bonding adhesives, including:

Spin-coat thermoplastics
Thermoset materials
Tapes

Where can I buy or get support for the EVG®850 TB in the UK?

As EV Group's official UK representative, IES provides UK-based sales, installation, and engineering support for the EVG®850 TB and the wider EVG temporary bonding portfolio.

Features:

• Open adhesive platform
• Various carriers (silicon, glass, sapphire, etc…)
• Bridge tool capability for different substrate sizes
• Available with multiple load port options and combinations
• Recipe controlled system
• Real time monitoring and recording of all relevant process parameters
• Fully integrated SECS/GEM interface
• Optional integrated inline metrology module for automated feedback loop

Applications:

• Thin-Wafer Processing / Backside Processing        
  For wafers that need to be thinned, backside etched, or otherwise processed, the temporary bonding to a robust carrier gives mechanical support during those fragile steps.
  
  
• 3D IC / TSV Integration        
  In 3D stacking or through-silicon-via (TSV) processes, temporary bonding is often needed to maintain wafer integrity while interconnects are formed, and then debonding is done later.

• MEMS / Sensor Fabrication        
  MEMS devices with fragile membranes or features benefit from bonding to carrier while backside or postprocessing is done.
  
  
• Heterogeneous Integration        
  When combining different types of substrates or materials, temporary bonding helps ensure that processing steps do not damage delicate layers.
  
  
• Process Development / R&D        
  The flexibility (open adhesive platform, modular design) means researchers/developers can test different adhesive chemistries, bonding recipes, and carriers.
  
  
• High-Yield / High-Quality Thin Wafer Flows        
  The optional inline metrology allows monitoring of key parameters (e.g. adhesive thickness uniformity, voids, warp) to reduce defects and wafer breakage.