EVG®850 LT

What is the EVG®850 LT?

Wafer bonding is a critical enabling technology for SOI wafer fabrication and wafer-level 3D integration. The EVG®850 LT is an automated production bonding system for mechanically aligned SOI and direct wafer bonding, using LowTemp™ plasma activation, with 300mm capability.

IES is the official UK representative for EV Group (EVG), supplying, installing, and supporting the EVG®850 LT for customers across the UK.

How does it streamline the fusion bonding process?

The EVG®850 LT combines all essential steps for fusion bonding — cleaning, plasma activation and alignment, pre-bonding, and IR inspection — in a single system, with automated cassette-to-cassette operation (ergo load, SMIF, or FOUP). This makes it a key enabler for SOI wafer fabrication and wafer-level 3D integration.

What results does it deliver in production environments?

Field-proven and established as an industry standard, the EVG®850 LT is a production system built to operate in high-throughput, high-yield environments, delivering void-free bonds for reliable results across a wide range of fusion/molecular wafer bonding applications.

Where can I buy or get support for the EVG®850 LT in the UK?

As EV Group's official UK representative, IES provides UK-based sales, installation, and engineering support for the EVG®850 LT and the wider EVG bonding equipment portfolio.

Features:

• SOI and direct wafer bonding with EVG's LowTemp™ plasma activation
• Suitable for a wide range of fusion/molecular wafer bonding applications
• Production system built to operate in high-throughput, high-yield environments
• Automated cassette-to-cassette operation (ergo load, SMIF or FOUP)
• Contamination-free backside handling
• Megasonic and/or brush cleaning
• Pre-bonding with mechanical flat or notch alignment Advanced remote diagnostics

Applications:

• Silicon-on-Insulator (SOI) Wafer Fabrication
  The EVG®850 LT is instrumental in producing SOI wafers by bonding a thin silicon layer onto an insulating substrate, a process vital for advanced semiconductor devices.
  
  
• Direct Wafer Bonding
  Facilitates direct bonding of wafers without the need for intermediate adhesives, enabling the creation of engineered substrates and layer transfer applications.
  
  
• 3D Wafer-Level Integration
  Supports wafer-level 3D integration by enabling the bonding of multiple wafer layers, essential for advanced packaging and heterogeneous integration.
  
  
• Backside Illuminated (BSI) CMOS Image Sensors
  Enables the fabrication of BSI CMOS image sensors by bonding wafers with precise alignment, enhancing the performance of imaging devices.
  
  
• Advanced Substrate Bonding
  Applicable in bonding various advanced substrates, including compound semiconductors and MEMS devices, for the development of next-generation electronic and photonic systems.