EVG®6200 BA
The EVG®6200∞ BA bond alignment system delivers high precision, flexibility, and ease of use, making it ideal for a wide range of production environments. With exceptional accuracy, the system supports the most demanding alignment processes in MEMS production, as well as emerging fields like 3D integration applications.
Features:
- Suitable for all EVG 200 mm bond systems
- Supports bond alignment of double or triple wafer stacks up to 200 mm wafer sizes
- Manual or motorized alignment stage with automatic alignment option
- Fully motorized high-resolution bottom-side microscopes
- Windows® based user interface
- Options
- Automatic alignment IR alignment for inner substrate key alignment
- NanoAlign® package for enhanced process capabilities
- Available with system rack
- Upgrade possibility to mask aligner
Applications:
- MEMS / Sensor Device Fabrication
Precise alignment of device wafers to capping or carrier wafers prior to bonding (e.g., for sealing, encapsulation, cavity formation). - 3D Integration / Stacked Wafers
Aligning multiple layers before bonding in 3D-IC or heterogeneous integration stacks. - Pilot / Low-Volume Production
In production settings where throughput matters, but full production systems may not be justified, 6200∞ BA is more automation-capable than earlier aligners yet more affordable than full-scale tools. - Bond Process Development & Optimization
For refining alignment tolerances, overlay budgets, and bonding yield in development labs before scaling to full production. - Technology Transfer / Scale-Up
Because this aligner is designed for production environments, processes developed using it can scale more directly to manufacturing bonders.