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A Complex Intercontinental Move and Assembly Project for Multiple Ion Implanters

At IES, we love a challenge. In fact, the more complex the project is, the better.

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The Subtle Art of Relocating Complex, One-of-a-Kind Equipment Across Borders

Few complex engineering projects compare to the challenge of relocating sensitive, high-technology equipment across borders.

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Equipment Partners

Trusted Partners for the Microelectronics Industry

At IES, we partner with leading global manufacturers to provide an extensive portfolio of advanced technologies supporting research, development, and production across the semiconductor and compound materials industries.

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Insights

Move complex, business-critical equipment

Whether you’re moving a single piece of equipment or an entire production line, our trusted team of engineers can support every step of your move, from rigging to end-to-end relocation support across the globe.

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EVG®620 BA

What is the EVG®620?

The EVG®620 is a bond alignment system renowned for its automation and reliability, combining high precision, flexibility, and ease of use across various production environments.

IES is the official UK representative for EV Group (EVG), supplying, installing, and supporting the EVG®620 for customers across the UK.

What is the EVG®620 used for?

Its exceptional precision makes the EVG®620 ideal for the most demanding alignment processes in MEMS production, as well as emerging applications such as 3D integration.

What makes the EVG®620 suited to production environments?

The EVG®620 is renowned for its automation and reliability, combining high precision, flexibility, and ease of use — qualities that translate well across a range of production environments, not just lab-scale use.

Where can I buy or get support for the EVG®620 in the UK?

As EV Group's official UK representative, IES provides UK-based sales, installation, and engineering support for the EVG®620 and the wider EVG bond alignment portfolio.

Features:

  • Most suitable for EVG®501, EVG®510, and EVG®520 IS bonding systems
  • Supports bond alignment of double or triple wafer stacks up to 150 mm wafer sizes
  • Manual or motorized alignment stage
  • Fully motorized high-resolution bottom-side microscopes
  • Windows® based user interface
  • Quick tool change between different wafer sizes and different bonding applications
  • Options Automatic alignment IR alignment for inner substrate key alignment
  • NanoAlign® package for enhanced process capabilities
  • Available with system rack
  • Upgrade possibility to mask aligner

Applications:

  • MEMS / Microdevice Bonding
    Aligning device wafers to capping wafers or membrane wafers prior to permanent bonding (e.g. sealing, encapsulation) in MEMS fabrication.

  • 3D Integration / Wafer Stacking
    Alignment of wafers for 3D stacking before bonding so that interconnects or features align correctly.

  • Pilot / R&D Bonding Flows
    In development labs or pilot fabs, EVG 620 BA offers higher automation and repeatability compared to manual bond aligners, but at lower cost and complexity relative to full production aligners.

  • Bond Process Development / Recipe Tuning
    Useful for exploring alignment tolerances, overlay budget requirements, and bonding misalignment sensitivity before scaling to higher-volume systems.

  • Small-run / Low-volume Bond Production
    For niche devices or low-volume production runs where throughput is moderate but alignment precision is important.

 

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See the capabilities of our partners' equipment - including EVG, scia Systems, Veeco, PPS and SSI - in action. Experience tailored demonstrations designed around your process and application needs.

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