EVG®560

What is the EVG®560?

The EVG®560 is a highly configurable production bonder, designed to deliver high-yield bonds with enhanced process control and automation. IES is the official UK representative for EV Group (EVG), supplying, installing, and supporting the EVG®560 for customers across the UK.

What is the EVG®560's bond chamber based on?

It builds on the proven bond chamber design of EVG's manual bonding systems, incorporating key features for optimised performance — so process knowledge from EVG's manual tools carries forward into a production-automated platform.

How does the EVG®560 automate production?

A robot handling system automates the loading and unloading of process chambers, streamlining operations for efficient, high-volume production and reducing manual intervention in the bonding workflow.

What level of process control does the EVG®560 offer?

The EVG®560 is highly configurable, giving enhanced process control alongside automation, so it can be tuned to deliver high-yield bonds across different production requirements.

Where can I buy or get support for the EVG®560 in the UK?

As EV Group's official UK representative, IES provides UK-based sales, installation, and engineering support for the EVG®560 and the wider EVG wafer bonding portfolio.

Features:

• Fully automated processing with automated loading and unloading of bond chucks
• Up to four bond chambers for various bonding processes
• Compatible with EVG mechanical and optical aligner including SmartView
• Simultaneous rapid heating and cooling on top and bottom side
• Automatic loading and unloading of bond chambers and cooling station
• Remote online diagnostics

Applications:

• High-Volume / Production Bonding        
  In processes where bonding is a bottleneck, the automation and multi-chamber design help scale to production volumes.
  
  
• Wafer-Level Packaging / 3D Integration        
  Bonding wafers in packaging, stacking dies, heterogeneous integration, advanced packaging flows benefit from full automation and high throughput.
  
  
• MEMS / Sensor Packaging        
  MEMS devices often need wafer-level sealing or capping; the 560 allows integration of such bonding steps into high-volume manufacturing.
  
  
• Process Scaling & Transfer        
  Because bond chamber designs are compatible with those used in manual and semi-automated tools, processes developed earlier can be transferred or scaled to the 560.
  
  
• Flexible / Mixed Bonding Flows
  The multiple bond chamber concept allows different bonding modalities to run in parallel or change over as required (e.g. one chamber for eutectic, one for direct, etc.).
  
  
• High Reliability / Yield-Critical Bonds       
  The uniform thermal control and automation reduce process variability, improving bond uniformity, yield, and reproducibility.