EVG®501

What is the EVG®501?

The EVG®501 is a highly flexible wafer bonding system that supports all common bonding processes — anodic, glass frit, solder, eutectic, transient liquid phase, and direct bonding — in a single tool. IES is the official UK representative for EV Group (EVG), supplying, installing, and supporting the EVG®501 for customers across the UK.

What bonding processes does the EVG®501 support?

The system covers the full range of standard wafer bonding methods, including:

Anodic bonding
Glass frit bonding
Solder bonding
Eutectic bonding
Transient liquid phase bonding
Direct bonding

Who is the EVG®501 designed for?

Its easy-access bond chamber and user-friendly tooling design allow quick retooling between different wafer sizes and processes, making it well suited to universities, R&D facilities, and low-volume production environments where flexibility matters more than raw throughput.

How does the EVG®501 support scale-up to production?

The bond chamber design mirrors that of EVG's high-volume manufacturing tools, such as the EVG® GEMINI, so bonding recipes developed on the EVG®501 transfer directly across. This gives a seamless path from R&D and low-volume work to larger production volumes as requirements grow, without having to redevelop processes from scratch.

Where can I buy or get support for the EVG®501 in the UK?

As EV Group's official UK representative, IES provides UK-based sales, installation, and engineering support for the EVG®501 and the wider EVG wafer bonding portfolio.

Features:

• Unique pressure and temperature uniformity
• Compatible with EVG mechanical and optical aligners
• Flexible design and configurations for research
• From single chips to wafers
• Various processes (eutectic, solder, TLP, direct bonding)
• Optional turbopump (<1E-5mbar)
• Upgradeable for anodic bonding
• Open chamber design for easy conversion and maintenance
• Pilot production compatible
• Open chamber design for easy conversion and maintenance
• Smallest footprint for a 200 mm bonding system: 0.8 m2
• Recipes are fully compatible with EVG’s high-volume-manufacturing bonding systems

Technical Data:

• Max contact force
  20 KN
• Heater Size 
  150 mm - single chips 
  200 mm - 100 mm
• Vacuum 
  Standard: 0.1 mbar
  Optional: 1E-5 mbar
• Max temperature: 
  450 °C
• Single chips processing
  Yes
• Bond chuck system / Alignment system
  150 mm heater: EVG^®610, EVG^®620, EVG^®6200
  200 mm heater: EVG^®6200, SmartView^® NT
• Active Water cooling 
  For bottom side
• Power supply for anodic bonding
  Max. voltage: 2 kV
  Max. current: 50 mA
• Loading chamber
  Manual

Applications:

• MEMS and Sensors: Fabrication of micro-electromechanical systems and sensors.
  
  
• Optical Devices: Production of waveguides and other optical components.
  
  
• 3D Integration: Stacking of chips for 3D integration.
  
  
• Advanced Packaging: Packaging of semiconductor devices.
  
  
• Research and Development: Development of new bonding processes and materials.