The MPS1400 RIE-ICP is used for single wafer processing equipment in research and development. It can be designed and manufactured to meet customer requirements.

Operational footprint can be minimised thanks to the mounting of all control equipment within the system mainframe. A modular design allows various electrode configurations, RF sources, and vacuum pumping packages to be incorporated into the build of the system.


  • Dielectric materials (SiO2, SiNx, etc.);

  • Silicon-based materials (Si, a-Si, poly-Si);

  • III-V materials (GaAs, InP, GaN, etc.);

  • Sputtered metals (Au, Pt, Ti, Ta, W, etc.);

  • Diamond-like carbon (DLC);

  • Failure Analysis;

  • ICP;

  • Metal Etching (Al, Ti, Ta, TiN, TaN);

  • Silicon (Trench & Deep Si Etch);

  • AlGaN, GaN, InP;

  • AlGaAs, GaAs.


  • PLC Control System

  • Touch Screen Interface

  • Stainless Steel Chamber

  • 160-200mm Electrode

  • Internal Gas Pod

  • Optional Loadlock

  • Water Cooled Electrode

  • Vacuum Pump Options