Mini Lab Plasma Pod System

Description:

Used specifically for research & development processes on substrates and small components up to a diameter of 125 mm, the Plasma Mod System possesses an aluminium chamber with a water cooled substrate electrode. This electrode can be accessed with a pneumatically operated top electrode. The Plasma Pod System comes with a PLC control unit and operator touch screen interface. Choose between automatic and manual operation, and utilise features such as data logging and process recipe storage.

System configuration can be tailored to particular processes and customer requirements. There is an Ethernet connection which can be used for system monitoring.

Used specifically for research & development processes on substrates and small components up to a diameter of 125 mm, the Plasma Mod System possesses an aluminium chamber with a water cooled substrate electrode. This electrode can be accessed with a pneumatically operated top electrode. The Plasma Pod System comes with a PLC control unit and operator touch screen interface. Choose between automatic and manual operation, and utilise features such as data logging and process recipe storage.

System configuration can be tailored to particular processes and customer requirements. There is an Ethernet connection which can be used for system monitoring.

Application:

Etching of the following materials:

  • Dielectric materials (SiO2, SiNx, etc.);

  • Silicon-based materials (Si, a-Si, poly-Si);

  • III-V materials (GaAs, InP, GaN, etc.);

  • Sputtered metals (Au, Pt, Ti, Ta, W, etc.);

  • Diamond-like carbon (DLC);

  • Failure Analysis.

Features:

  • Small system footprint Integral Gas Box and internal turbo pump Substrates up to 125mm in diameter Aluminium chamber with water-cooled substrate electrode Manual or automatic operation.