The EVG50 is a stand-alone, fully automated tool which works with EVG’s integrated Inline Metrology Module to provide high accuracy measurements at a fast speed. It does this using various measurement methods for a wide range of applications. The tool offers multi-layer thickness measurements, and can be utilised to inspect bond interfaces, resist thickness measurement or determine the total thickness variation of intermediate layers. As such, the EVG is capable of meeting demanding requirements in the yield-focused semiconductor industry.


  • Multi-layer metrology with industry-leading throughput and resolution
  • Multi-layer-thickness mapping
  • Bond interface inspection
  • Low contact edge handling
  • Particle free
  • Full-area accessible front- and backside
  • Self-calibrating for better system reproducibility and more productive time
  • Various output formats
  • 100% production inspection