The live imaging offered by the EVG20 provides a quick inspection method which is designed for fusion bonded wafers. Void detection down to a 0.5mm radius is supported by a complete view of the wafer through IR transmission. This infrared inspection system is the ideal technology for fusion bonding; as a station in an EVG integrated bonding system, or as a standalone tool.


  • Live imaging
  • One-shot inspection of the entire wafer
  • Optional bond pin for live visualization of direct bonding
  • Maszara test compatible
  • Void size detection down to 0.5 mm radius