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EVG®6200 NT

The EVG6200 is recognised for its reliability and automation versatility, offering updated mark alignment technology on a minimised foot print area. It also provides advanced alignment features, maximised throughput, and optimised total cost of ownership. The EVG6200 benefits from operator-friendly software, and a minimised time for tooling and mask changes – this makes it a suitable solution for a broad variety of manufacturing environments.

Both the EVG6200 NT and the fully housed EVG6200 NT Gen2 option offer the choice between semi or fully automated configuration. They are able to attain superb exposure results - including thin and thick resists exposure, comparable topographies, and deep cavity patterning - for many applications thanks to vibration isolation integration. These solutions are suitable for the processing of compound semiconductors, and other thin and fragile materials. Semi-automated and fully automated system configurations both support EVG’s SmartNIL technology.

Features

  • Wafer/substrate size from pieces up to 200 mm/8’’
  • System design supporting versatility of lithography processes
  • Throughput up to 180 WPH in first print mode or up to 140 WPH in automatic alignment mode
  • Fragile, thin or warped wafer handling of multiple wafer sizes with quick change-over time
  • Automated contact-free wedge compensation sequence with proximity spacers
  • Auto origin function for precise centering of alignment key
  • Dynamic alignment function featuring real-time offset correction
  • Supports the latest UV-LED technology
  • Rework sorting wafer management and flexible cassette system
  • Manual substrate loading capability on automated system
  • Field upgradeable from semi-automated to fully automated version
  • Minimized system footprint and facility requirements
  • Multi-user concept (unlimited number of user accounts and recipes, assignable access rights, different user interface languages)
  • Advanced Software features and compatibility between R&D and full-scale production
  • Agile processing and conversion re-tooling
  • Remote tech support & SECS/GEM compatibility
  • Table top or stand-alone version with anti-vibration granite table
  • Additional capabilities:
  • Bond alignment
  • IR alignment
  • Nanoimprint lithography (NIL)