Supporting a range of standard lithography processes – including proximity, soft, hard and vacuum exposure modes – with its back side alignment options, the EVG610 provides additional functions such as nanoimprint lithography (NIL) and bond alignment. The EVG610 provides rapid processing and re-tooling for switching user requirements – the conversion time is under two minutes. In offering a multi user concept which can be adapted from novice to expert level, the EVG610 can be ideal for R&D and university applications.


  • Wafer/substrate size from pieces up to 200 mm/8’’
  • Top-side and bottom-side alignment capability
  • High-precision alignment stage
  • Automated wedge compensation sequence
  • Motorized and recipe-controlled exposure gap
  • Supports the latest UV-LED technology
  • Minimized system footprint and facility requirements
  • Step-by-step process guidance
  • Remote tech support
  • Multi-user concept (unlimited number of user accounts and recipes, assignable access rights, different user interface languages)
  • Agile processing and conversion re-tooling
  • Table top or stand-alone version with anti-vibration granite table
  • Additional capabilities:
  • Bond alignment
  • IR alignment
  • Nanoimprint lithography (NIL)