The EVG150 is a fully modular platform which enables high throughput performance and automated develop, spin and spray processes. The tool is relied upon for improved repeatability and highly uniform coats. Thanks to EVG’s OmniSpray technology, the limitations presented by traditional spin coating platforms are negated, allowing high topography wafers to be uniformly coated.


  • Wafer sizes up to 300 mm
  • Up to six process modules
  • Customizable number - up to twenty bake/chill/vapor prime stacks
  • Up to four FOUP load ports or cassette loading
  • Available modules include Spin Coat, Spray Coat, NanoCoat™, Develop, Bake/Chill/Vapor/Prime
  • EV Group’s proprietary OmniSpray® ultrasonic atomization technology provides unmatched process results when it comes to conformal coating of extreme topographies
  • Optional NanoSpray™ module achieves conformal coating of 300-micron deep patterns with aspect ratios up to 1:10 and vertical sidewalls
  • Extensive range of supported materials
  • Bake modules for up to 250 °C
  • Megasonic technology for cleaning, sono-chemical processing and developing improves process efficiency and lowers the process time from hours to minutes
  • Sophisticated and field-proven robot handling with dual end-effector capability ensures continuous high throughput
  • Handling of thick or ultra-thin, fragile, bowed or small-diameter wafers 
  • Versatile combinations of multi-functional modules for spin and spray coating, developing, bake and chill provide great opportunities in many fields of application
  • EFEM (Equipment Frontend Module) and optional FSS (FOUP Storage System)
  • Process technology excellence and development service
  • Multi-user concept (unlimited number of user accounts and recipes, assignable access rights, different user interface languages)
  • Smart process control and data analysis feature [Framework SW Platform]
  • Integrated analysis features for process and machine control
  • Equipment and process performance tracking feature
  • Parallel/queueing task processing feature
  • Smart handling features
  • Occurrence and alarm analysis
  • Smart maintenance management and tracking