scia Trim 200
Used for high precision film thickness trimming in wafer processing, the scia Trim 200 is a high volume production system which accommodates a standard semiconductor cassette handling robot. It is used for applications such as frequency and thickness trimming in acousto-electrical device manufacturing, and the production of filters like surface acoustic wave and bulk acoustic wave devices.
The scia Trim 200 is also suitable for trimming precision thin film resistors and localised pole trimming for thin film heads. Cluster tools are available, including two cassette load locks and two process chambers.