scia Mill 150
Used for the highly uniform ion beam etching and milling of singles substrates up to a diameter of 150 mm diameter, the scia Mill 150 provides an automatic handing system for the loading of wafers and carriers.
Offering a substrate holder with helium backside cooling and optimum manoeuvrability, the scia Mill 150 is typically used for applications such as structuring metal films for sensors and MEMS. The system can also be utilised for reactive ion beam etching, chemically assisted ion beam etching and ion beam etching with inert gases. The scia Mill 150 is ideal for low volume production, as well as research and development processes.