GEMINI is an automated production wafer bonding system which delivers the maximum degree of process integration and automation. For volume manufacturing, this fully automated platform enables wafer-to-wafer alignment and wafer bonding processes up to 200 mm. The system affords device manufacturers the benefits of a high integration level, boosted production output, and a wide range of bonding methods – including silicon fusion, anodic, eutectic bonding and thermo compression – to choose from.


  • Fully automated and integrated platform for wafer-to-wafer alignment and wafer bonding
  • Configuration options for bottom-side, IR or SmartView alignment
  • Multiple bonding chambers
  • Wafer handling system is separated from bond chuck handling system
  • Modular design with swap-in modules
  • Combines all benefits from EVG's precision aligners and EVG®500 series systems
  • Minimized footprint compared to stand-alone systems
  • Optional process modules:
  • LowTemp™ plasma activation
  • Wafer cleaning
  • Coat module
  • UV bond module
  • Bake/chill modules
  • Alignment verification module