The EVG805 semi-automated debonding system is designed for temporary bonded and processed wafer stacks made up of a carrier wafer device wafer, and an intermediate temporary bonding adhesive. Both mechanical and thermal debonding can be supported by the tool, and thin wafer is typically unloaded on a single substrate carrier for secure transport between tools.


  • Open adhesive platform
  • Debond Options:
  • Thermal slide off debonding
  • Lift off debonding
  • Mechanical debonding
  • Recipe controlled system  
  • Real time monitoring and recording of all relevant process parameters
  • Unique features for thin-wafer handling
  • Various chuck designs to support wafer/substrates and carriers up to 300 mm
  • High topography wafer handling