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EVG®610 BA

The EVG610 is a bond alignment system which is intended for wafer-to-wafer alignment. It can be used with wafer sizes of up to 200mm. EVG’s bond alignment systems are recognised for their high precision manual alignment stage with a bottom side microscope. Thanks to the precision afforded by the EVG610’s bond alignment system, it accommodates exacting alignment processes in fields such as 3D integration applications, and MEMS production.

Features

  • Most suitable for EVG®501 and EVG®510 bonding systems
  • Wafer and substrate sizes up to 150 / 200 mm
  • Manual high-precision alignment stage
  • Manual-operated bottom-side microscope
  • Windows® based user interface
  • Perfect multi-user concept (unlimited number of user accounts, various access rights, different user interface languages)
  • Desktop system design with minimum footprint
  • Supports IR alignment process
  • Optimum total cost of ownership (TCO) for R&D and pilot line production