The EVG540 is an automated wafer bonding system which is a single chamber production bonder that is suitable for R&D in high volume manufacturing and pilot line manufacturing. The EVG540 is based on a modular design and offers a reliable solution for transitioning wafer bonding processes; from R&D to large scale manufacturing.


  • Single-chamber bonder up to 300 mm substrate size
  • Compatible with SmartView® and MBA300
  • Automatic handling of up to four bond chucks
  • Compliant to high safety standards