Handling substrate sizes from pieces up to 200 mm, the EVG510 is a very adaptable wafer bonding system which supports common bonding processes including anodic, solder, transient liquid phase, direct and glass frit and eutectic. Simple retooling for various wafer sizes and processes with a conversion time of under five minutes is made possible by the EVG510’s tooling design and easy access bond chamber. Thanks to its flexibility, the EVG510 is suitable for a range of facilities – from low volume production applications to R&D settings and universities. The tool features the same bond chamber design as the EVG Gemini and the other high volume manufacturing tools in the EVG range. The EVG510 facilitates easily transferable bonding recipes which are conducive to easy production volume scale up.


  • Unique pressure and temperature uniformity
  • Compatible with EVG mechanical and optical aligners
  • Flexible design and configurations for research and piloting
  • Form single chips to wafers
  • Various processes (eutectic, solder, TLP, direct bonding)
  • Optional turbopump (<1E-5 mbar)
  • Upgradeable for anodic bonding
  • Open chamber design for easy conversion and maintenance
  • Production compatible
  • High throughput with fast heating and pumping specifications
  • High yield through automatic wedge compensation
  • Open chamber design for fast conversion and maintenance
  • Smallest footprint for a 200 mm bonding system: 0.8 m2
  • Recipes are fully compatible with EVG’s high-volume-manufacturing bonding systems