Handling wafers and substrates between process stations, the EVG320 is an automated single wafer cleaning system. Thanks to its robotic handling system, pre-alignment and loading of wafers is ensured automatically in FOUP-to-FOUP or cassette-to-cassette operations. In addition to DI-water rinse, take advantage of configuration choices including brush, megasonic and diluted chemicals cleaning.


  • Up to four cleaning stations
  • Fully automated cassette-to-cassette or FOUP-to-FOUP handling
  • Edge handling for double-sided cleaning processes available (option)
  • High-efficiency cleaning using 1 MHz megasonic nozzles or area transducers (option)
  • Advanced remote diagnostics
  • Prevents cross-contamination from back to front side
  • Fully software controlled cleaning process