Handling wafers and substrates between process stations, the EVG320 is an automated single wafer cleaning system. Thanks to its robotic handling system, pre-alignment and loading of wafers is ensured automatically in FOUP-to-FOUP or cassette-to-cassette operations. In addition to DI-water rinse, take advantage of configuration choices including brush, megasonic and diluted chemicals cleaning.
- Up to four cleaning stations
- Fully automated cassette-to-cassette or FOUP-to-FOUP handling
- Edge handling for double-sided cleaning processes available (option)
- High-efficiency cleaning using 1 MHz megasonic nozzles or area transducers (option)
- Advanced remote diagnostics
- Prevents cross-contamination from back to front side
- Fully software controlled cleaning process